Precision, Low-Power, 6-Pin SOT23
Temperature Sensors and Voltage References
Sensing Circuit Board and
Ambient Temperatures
Temperature sensor ICs, like the MAX6610/MAX6611
that sense their own die temperatures, must be mount-
ed on, or close to, the object whose temperature they
are intended to measure. Because there is a good ther-
mal path between the package ’ s metal leads and the
IC die, the MAX6610/MAX6611 can accurately measure
the temperature of the circuit board to which it is sol-
dered. If the sensor is intended to measure the temper-
ature of a heat-generating component on the circuit
board, it should be mounted as close as possible to
that component and should share supply and ground
traces (if they are not noisy) with that component where
possible. This maximizes the heat transfer from the
component to the sensor. The thermal path between
the plastic package and the die is not as good as the
path through the leads, so the MAX6610/MAX6611, like
all temperature sensors in plastic packages, are less
sensitive to the temperature of the surrounding air than
to the temperature of the leads. They can be success-
fully used to sense ambient temperature if the circuit
board is designed to track the ambient temperature.
As with any IC, the wiring and circuits must be kept
insulated and dry to avoid leakage and corrosion,
especially if the part is operated at cold temperatures
where condensation can occur.
Self-Heating
The MAX6610/MAX6611 are low-power circuits and are
intended to drive light loads. As a result, the tempera-
ture rise due to power dissipation on the die is insignifi-
cant under normal conditions.
For example, assume that the MAX6611 is operating
from a 5V supply at +50 ° C (V TEMP = 2V) and that the
temperature output is driving a 100k ? load (I TEMP =
20μA). Also assume that the voltage reference is dri-
ving a 500μA load and the worst-case quiescent supply
current is used. In the 6-pin SOT23 package, the die
temperature increases above the ambient by 0.2 ° C.
Next, assume TEMP and REF are driving their maxi-
mum loads (I TEMP = 500μA and I REF = 1mA) and V CC
= 5V, and T A = +50 ° C (V TEMP = 2V). Here, the die tem-
perature increases above the ambient by 0.4 ° C.
A first order for self-heating effects can be estimated
from temperature and reference load currents and the
previous supply voltage.
Chip Information
TRANSISTOR COUNT: 1346
PROCESS: BiCMOS
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